JPS6239543B2 - - Google Patents

Info

Publication number
JPS6239543B2
JPS6239543B2 JP54053486A JP5348679A JPS6239543B2 JP S6239543 B2 JPS6239543 B2 JP S6239543B2 JP 54053486 A JP54053486 A JP 54053486A JP 5348679 A JP5348679 A JP 5348679A JP S6239543 B2 JPS6239543 B2 JP S6239543B2
Authority
JP
Japan
Prior art keywords
lead
frame
cut
main frame
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54053486A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55146951A (en
Inventor
Kazuo Shimizu
Fumihito Inoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5348679A priority Critical patent/JPS55146951A/ja
Publication of JPS55146951A publication Critical patent/JPS55146951A/ja
Publication of JPS6239543B2 publication Critical patent/JPS6239543B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5348679A 1979-05-02 1979-05-02 Lead frame Granted JPS55146951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5348679A JPS55146951A (en) 1979-05-02 1979-05-02 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5348679A JPS55146951A (en) 1979-05-02 1979-05-02 Lead frame

Publications (2)

Publication Number Publication Date
JPS55146951A JPS55146951A (en) 1980-11-15
JPS6239543B2 true JPS6239543B2 (en]) 1987-08-24

Family

ID=12944166

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5348679A Granted JPS55146951A (en) 1979-05-02 1979-05-02 Lead frame

Country Status (1)

Country Link
JP (1) JPS55146951A (en])

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59500340A (ja) * 1982-03-08 1984-03-01 モトロ−ラ・インコ−ポレ−テツド 集積回路のリ−ドフレ−ム
JPS59104149A (ja) * 1982-12-06 1984-06-15 Hitachi Chem Co Ltd 半導体類のパツケ−ジ成形方法
JPS59132640A (ja) * 1983-01-20 1984-07-30 Nec Corp 半導体素子用リ−ドフレ−ム
JPS60176552U (ja) * 1984-04-28 1985-11-22 凸版印刷株式会社 エツチング部品
JPS6139558A (ja) * 1984-07-31 1986-02-25 Toshiba Glass Co Ltd 半導体回路基板
JPH04164357A (ja) * 1990-10-29 1992-06-10 Nec Corp 半導体装置用リードフレーム

Also Published As

Publication number Publication date
JPS55146951A (en) 1980-11-15

Similar Documents

Publication Publication Date Title
US6924548B2 (en) Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like section
US6187614B1 (en) Electronic component, method for making the same, and lead frame and mold assembly for use therein
EP0701280B1 (en) Lead frame and process of producing it
KR100568225B1 (ko) 리드 프레임 및 이를 적용한 반도체 패키지 제조방법
JPS6239543B2 (en])
CN213401185U (zh) 一种防弯折变形的引线框架及封装料片
JPH022294B2 (en])
TW202529257A (zh) 減少切單時刀損耗的導線架結構
JP3973348B2 (ja) レーザ装置及びその製造方法
JP2006186075A (ja) 表面実装部品およびその製造方法
JPS61170053A (ja) 半導体装置用リ−ドフレ−ム
JP4785642B2 (ja) レーザ装置
KR960003854B1 (ko) 반도체 장치 제조방법
JP2555989B2 (ja) 樹脂封止型半導体装置およびリードフレーム
JP2748620B2 (ja) 半導体装置
JP3747991B2 (ja) 半導体装置の製造方法
JPS62128163A (ja) リ−ドフレ−ム
JPS644347B2 (en])
KR200154644Y1 (ko) 리드프레임 및 이 리드 프레임을 성형하기 위한 금형
JPH0821660B2 (ja) リードフレームの製造方法
JPS6142858B2 (en])
JPS58182858A (ja) リ−ドフレ−ム
JPS6020948Y2 (ja) 電子部品
JPS6245157A (ja) 電子部品の製造方法およびその方法において用いられるリ−ドフレ−ム
KR100470510B1 (ko) 리드프레임의 구조